The goal is to develop a flat-packaged (<1 mm thick) MEMS-based optical wall shear stress sensor that can be extended to hightemperature environments (T>1000°C). This technology is targeted to enable wall shear stress measurements in hypersonic boundary layers. This work leverages novel microfabrication techniques and packaging schemes that directly contribute to the MIST Center’s goal of integrating new processes and devices into multi-functional systems.

Dvelops a package for a cardiac immunosensor which will enable hermetically housing the sensor and prototype wireless data extraction of impedance from the microsensor.